Talking about the classification summary of PCB aluminum substrate

PCB aluminum substrate has many names, aluminum cladding, aluminum PCB, metal clad printed circuit board (MCPCB), thermally conductive PCB, etc. The advantage of PCB aluminum substrate is that the heat dissipation is significantly better than the standard FR-4 structure, and the dielectric used is usually It is 5 to 10 times the thermal conductivity of conventional epoxy glass, and the thickness is one-tenth of the heat transfer index is more efficient than the traditional rigid PCB. Let’s understand the varieties of PCB aluminum substrates below.

PCB aluminum substrate classification

1. Flexible aluminum substrate

One of the latest developments in IMS data is flexible dielectrics. These materials can provide excellent electrical insulation, flexibility and thermal conductivity. When applied to flexible aluminum materials such as 5754 or similar, the product can be constructed to complete various shapes and angles, which can eliminate expensive fixed installations, cables and connectors. Although these materials are flexible, they are designed to bend in place and stay in place.

2. Mixed aluminum aluminum substrate

In the "hybrid" IMS construction, the "sub-components" of non-thermal materials are handled independently, and then AmitronHybridIMSPCBs are bonded to the aluminum substrate with thermal materials. The most common structure is a 2-layer or 4-layer subassembly made of traditional FR-4. This layer is bonded to an aluminum substrate with a thermoelectric to help dissipate heat, improve rigidity, and act as a shield. Other benefits include:

1. The cost is lower than the construction of all thermal materials.

2. Provide better thermal performance than standard FR-4 products.

3. It can eliminate expensive radiators and related assembly steps.

4. It can be used in RF applications that require the RF loss characteristics of the PTFE outer surface.

5. Use component windows in aluminum to contain through-hole components. This allows connectors and cables to pass the connector through the substrate, while welding rounded corners to create a seal, without the need for special gaskets or other expensive adapters.

Three, multilayer aluminum substrate

In the high-performance power supply market, multi-layer IMSPCB is made of multi-layer thermally conductive dielectric. These structures have one or more layers of circuits buried in the dielectric, and blind vias are used as thermal vias or signal paths. Although single-layer designs are more expensive and less efficient to transfer heat, they provide a simple and effective heat dissipation plan for more complex designs.

Four, through-hole aluminum substrate

In the most complex structure, a layer of aluminum can form the "core" of the multilayer thermal structure. Before lamination, electroplating and dielectric filling of aluminum are stopped in advance. Thermal materials or sub-components can be laminated to both sides of aluminum using thermal adhesive materials. Once laminated, the finished component is drilled similar to a traditional multilayer aluminum substrate. Plated through holes pass through gaps in the aluminum to maintain electrical insulation. Alternatively, the copper core can allow direct electrical connection and insulating vias.